Principais Especificações
Processor | Intel® 13th generation Core I Processor |
Chipset | Intel® Q670 |
System Memory | Support DDR4 3200 SO-DIMM x 2 up to 64GB |
OS Support | Windows® 10 , Windows® 11 , Linux (optional) |
Storage Disk Drive | 2.5″ SATA SSD x 2 , M.2 M Key NVMe x 2 |
TPM | 2.0 |
Entradas e Saídas
USB | USB 3.2 Gen 2 x 4 , USB 2.0 x 2 |
Ethernet | 2.5 GigaLAN x 2 |
Video out | HDMI x 1, DP x 2 , VGA x 1 |
Audio | Mic-in x 1 , Line-out x 1 |
Series Ports | RS-232 x 2 |
Function I/O | Grouding Pin x 1 |
Power | AC input |
Front I/O | USB 3.0 x 2 , Power Button x 1 |
Extension area |
M.2 E Key 2230 x 1 for Wireless module, PCIe [x4] x1 (optional) , PCIe [x16] x1 |
Condições Mecânicas e Ambientais
Power Consumption | 100V to 240V AC Input, 500W |
Operating Temperature | 0°C ~ 35°C(32°F ~ 95°F) |
Storage Temperature | -20°C ~ 60°C(-4°F ~ 140°F) |
Dimension | 420 x 87 x 370 mm |
Package Size | 500 x 228 x 632 mm |
Gross Weight | 11 kg |
Net Weight | 8kg |
Certifications | CE: EN 60601-1-2: 2015 + A1: 2021 (V4.1), EN 60601-1: 2007 + A1:2013 +A2:2021 (V3.2) EN 55032:2015/A1:2020 EN 55035:2017/A11:2020 (ITE) IEC 62368-1:2020+A11:2020 (ITE) FCC: Part 15B/ Part 18 UL: ANSI AAMI ES60601-1:2005/A1:2012/ A2:2021(V3.2) cUL: CAN/CSA-C22.2 No. 60601-1:14 (IEC 60601-1: 2005+A1:2012+A2:2020,MOD) (V3.2) |